Silicon Carbide (SiC) & Gallium Nitride (GaN) are new chip technologies that are currently gaining attraction in the industry. These technologies are significantly better than Silicon when it comes to performance and other intrinsic properties.
TPC understands the criticality of these devices, ergo, TPC has created a dedicated process line for these types of chip technologies
WAFER SAWING
These special chip technologies are more rigid and require special treatment, especially at sawing. TPC has developed a process of sawing these wafers efficiently and with very high yield.
FRONT OF LINE
Die Attach and Wirebonding are also core to the processing of these packages due to the new chips’ characteristics. TPC have considered these characteristics in order to efficiently and effectively process these new chip technologies.
TPC, with almost 10 years of proven experience in processing SiC and GaN, is committed to provide quality packages that can house these brand new technologies... your devices that would shape the future.
If you want to know more about SiC and GaN or about TPC’s offerings, kindly send an email to tpc-customer@teamglac.com and we’ll be more than happy to provide you with more information.