About us

About Us


Team Pacific Corporation is a leading service provider for Semiconductor Assembly and Test, differentiated by its capabilities in complex high power and high reliability semiconductor assembly in both standard and custom build outline packages for specific solutions.

Equipped with more than 35 years of industry experience in both technical and service excellence, Team Pacific Corporation prides itself to be a leader in complex semiconductor assembly such as high power discrete devices in SOT-227 (available in 6 variants) and eXp TO247 packages; various isolated transistor outlines (including TO-247 4 leads high creepage) and custom build power modules (VPMPs); highly reliable hermetic packages; and medical die inspection and die sales. Our current customers use these products on a broad range of applications such as optoelectronic sensors, audio, military, medical, transportation, industrial, and renewable energy, including some devices used in the International Space Station (ISS). This establishes our deep commitment to quality as we continue to remain as a strategic partner of our customers.

In line with the ever-changing requirements of the industry and of our customers, Team Pacific Corporation also provides customized services aside from the usual subcontracting arrangement. The company is able to help customers in process development, especially if a custom package outline is required. We are also capable of setting-up captive assembly lines that can be co-managed with the customers, as well as full assembly line transfers from customers who want to re-focus their organization on product development.

Corporate Overview


Company Name TEAM PACIFIC CORPORATION
Location Electronics Ave., FTI Special Economic Zone, Taguig City, 1630 Philippines
Date Founded September 1, 1987
Executive Committee 
President / CEO
Federico M. Fernandez
SVP / CFO Salvador C. Bolongan
EVP / COO Vivian B. Mawis
AVP - Sales & Marketing Anthony N. Teng
Number of Employees Over 700 employees, including 3 executives and 20 managers
Facility Total Land Area:  17,050 square meters
Total Floor Area 10,158 square meters
Clean Room (50K) 1,200 square meters
Corporate Mission
Our mission is to meet customers' requirements while achieving the financial targets set by our shareholders.
Corporate Vision
Our vision is to become the leading service provider in the business of the complex assembly of high voltage power semiconductor devices.
TPC Quality Policy
TEAM Pacific Corporation is committed to continuous improvement in delivering quality products and services that satisfy the needs, expectations, and requirements of the customers.

TPC Quality Philosophy

It is the personal responsibility of every employee to have a zero defect mindset which emphasizes continuous improvement, customer focus, employee empowerment, data driven decision making and bottom line thinking.


Values

I-TPC: Our Corporate Value

Our guiding values are uprightness (integrity), team-shared vision, professionalism, and competency.

 

Additionally, we value our stakeholders and we are committed to:

1. Provide our employees with opportunities for continuous education for professional and personal growth.

We build a culture that promotes innovation, creativity, and informed risk-taking and reward accomplishments.

  • Encourage employees to come up with their own development plans.

  • Support employees’ desire to attend scheduled training and development programs aligned with their plans.

  • Incorporate skill enhancement topics in the learning moment sessions.

  • Involve concerned employees in problem solving analysis.

  • Encourage employees to provide mutual support to each other, as they would treat customers.

  • Refine and implement a meaningful reward system.

 

2. Listen and respond to our customer's needs and be innovative in all our approaches.

  • A customer account coordinator will be responsible to ensure satisfaction of specific customers in the areas of technical issues, customer requests and cost-reduction initiatives.

  • Respond to customer complaints through 8D methodology within an average of 5 days.

  • Treat all customers fairly regardless of business volume.

  • Regular visits to customers by top management.

  • Provide on-line services to customers for the following: WIP, yield and quality data, DCC, etc.

 

3. Work with our suppliers in developing and improving products and services.

  • Do business with Suppliers under mutually beneficial arrangement.

  • Actively involve Suppliers in our continuous improvement programs and help them towards its achievement.

  • Work with Suppliers as a business partner and constantly give feedback of their performance.

  • Recognize Suppliers performance by giving rewards and incentives.

 

4.Optimize use of our resources and foster a culture that turns potentially adverse conditions to opportunities for growth, resulting to fair return on our stockholders' investment.

  • Show continuous improvement of profit from operations.

  • Be transparent in supporting financial performance.

  • All employees strive to eliminate wasteful practices.

 

5. Participate in the community's environmental and social initiatives.

  • Comply with existing local and international standards and regulations concerning environment.

  • Encourage employees to contribute time, talent and treasure to social initiative as a service to the community.

  • Pursue change and challenge the status quo in all our endeavors.


History Growth Drivers


2021

Started preparation for Automotive Certification

2018

Qualified New Processes (Ag Sintering, Mesa Wafer Sawing, SiC Wafer Sawing)

2017

Launched True 2L TO-247

2012

Launched Versatile Power Module Packages (VPMP1, VPMP2, VPMP3, VPMP4, VPMP4i,)

2010

Launched eXp TO247

2003

Power Modules: SMART SOT-227

2001

Power Devices: Co-development for ISOPLUS Packages

2000

Test Power Devices

1999

Assembly and Test: Hermetic Packages

1998

Application Specific Power Module (ASPM)

1994

Power Devices: TO 268 and Hybrid Metal Cans

1993

Power Devices: TO 264 and IcePAK

1991

Power Devices: SOT 227 and TO 247

1989

Introduction of Power Devices and Standard PDIPs

1987

Started Hermetics Metal Can and CDIPs; Optoelectronics