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Team Pacific Corporation is a leading service provider for Semiconductor Assembly and Test, differentiated by its capabilities in complex high power and high reliability semiconductor assembly in both standard and custom build outline packages for specific solutions.
Silicon Carbide and Gallium Nitride Package Assembly...
Silicon Carbide (SiC) & Gallium Nitride (GaN) are new chip technologies that are currently gaining attraction in the industry. These technologies are significantly better than Silicon when it comes to perform...
Silicon Carbide (SiC) & Gallium Nitride (GaN) are new chip technologies that are currently gaining attraction in the industry. These technologies are significantly better than Silicon when it comes to perform...
Team Pacific Corporation is now capable of Mesa Wafer...
TPC commonly processes planar-type of dice (see Figure 1). Mesa-type of dice shown in Figure 2 have a different structure (mesa or table-top appearance) compared to planar-type. This ‘mesa-groove&rs...
TPC commonly processes planar-type of dice (see Figure 1). Mesa-type of dice shown in Figure 2 have a different structure (mesa or table-top appearance) compared to planar-type. This ‘mesa-groove&rs...
