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Team Pacific Corporation is a leading service provider for Semiconductor Assembly and Test, differentiated by its capabilities in complex high power and high reliability semiconductor assembly in both standard and custom build outline packages for specific solutions.
Team Pacific Corporation is now ready for the Silver...
Sintering is one of the emerging technologies in power devices because of its compatibility to high operating temperature packages that the Silicon Carbide (SiC) and Gallium Nitride (GaN) packages normally require. Moreo...
Sintering is one of the emerging technologies in power devices because of its compatibility to high operating temperature packages that the Silicon Carbide (SiC) and Gallium Nitride (GaN) packages normally require. Moreo...
Flatness and the Transfer of Heat
One of the biggest factors that is always considered in the semiconductor industry is heat and its movement. As we all know, semiconductor chips (or dice) produce heat during operation and when the heat stays on the chip...
One of the biggest factors that is always considered in the semiconductor industry is heat and its movement. As we all know, semiconductor chips (or dice) produce heat during operation and when the heat stays on the chip...
