SOT-227 Pad B and Pad C
PRODUCT SPECIFICATIONS
| PACKAGE TYPE | SOT 227 Pad B | SOT 227 Pad C |
|---|---|---|
| Frame Type | Pad B | Pad C |
| Lead Type | 4L | 4L |
| Frame Material | C110 / C102 / C122 Semi-Bright Finish / Matte Finish |
C110 / C102 / C122 Semi-Bright Finish / Matte Finish |
| Package Dimension (LxWxH) | inches : 1.50 x 0.980 x 0.476 mm : 38.10 x 24.89 x 12.09 |
inches : 1.50 x 0.980 x 0.476 mm : 38.10 x 24.89 x 12.09 |
| Pad Size | inches : 0.500 x 0.700 mm : 12.70 x 17.78 |
inches : 0.600 x 0.730 mm : 15.24 x 18.54 |
| Maximum Die Size | inches : 0.460 x 0.660 mm : 11.68 x 16.76 |
inches : 0.560 x 0.690 mm : 14.22 x 17.52 |
| Number of Die Capable | Multi-chip: Diode/IGBT/MOSFET/Thyristor die combination |
Multi-chip: Diode/IGBT/MOSFET/Thyristor die combination |
COMMON SPECIFICATIONS
| Die Attach Medium (soft solder) | Leaded (Pb/Sn/Ag) or Lead Free (Sn/Ag) |
| Substrate | Metallized Aluminum Nitride (AlN) Metallized Aluminum Oxide (Al203) |
| Wire Size | 5, 8, 10, 12,15 and 20 mils Al |
| Mold Type | Epoxy Mold Compound |
| Isolation | 3KV minimum |
| Rating | 1200V / 100A |
| Applications | Industrial, Medical, Automotive, Aviation, Renewable Energy |
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