Wafer Saw


- 3 mils to 34 mils thick 
- 8 inches wafer diameter 
- Si, GaN-on-Si, and SiC 
- Auto wafer saw and Ultratech Cleaner with CO2 Re-ionizer to maintain water resistivity of 0.1 to 1 Mohm-cm 
- 100% saw through and partial cut

Die and DBC Attach

 - Soft and Eutectic solder attach process using belt furnace, vacuum oven and auto die attach (with leaded and leadfree capability) 
- Automated Solder Paste application

Wirebond 

- Ultrasonic bonding 
- Automatic wirebonder; capable for Aluminum wires (1.25 to 20 mils aluminum wire 99.99% or 99.999%)
- Fully automatic equipment, deep access with stitch-bonding capability.

MOLD (for Discrete Packages) 

- Conventional mold die sets with auto-frame loaders (120 to 175 tons capacity) 
- Sensor equipped pellet pre-heaters 
- Green mold compound technology

Marking (Discrete Packages) 

 - Laser engraved marking


Marking (For Module Packages) 

- Marking using sticker label
- Computer-based Zebra thermal printer

Trim and Form (For Discrete Packages) 

- Dedicated DTFS die sets for plastic packages. 
- Hydraulic press (max capacity 1500psi) 
- Pneumatic press (max capacity 100psi)

Silicone Gel / Potting Application 

- Manual vacuum degassing 
- Dedicated Oven curing (max of 250°C) 

Terminal Attach (Power Modules)

 - Manual dispensing equipment (controls on air pressure and dispensing time)