EXT SOT-227
PRODUCT SPECIFICATIONS
| Frame Type | Parallel / Anti-Parallel |
| Lead Type | 3L / 4L / 6L |
| Frame Material | C110 / C102 / C122 Semi-Bright Finish |
| Package Dimension (LxWxH) |
inches : 2.08 x 1.10 x 0.550 mm : 52.83 x 27.94 x 13.97 |
| Pad Size | Per required DBC substrate |
| Maximum Die Size | Per required DBC substrate |
| Number of Die Capable | Dual Driver, 2 Independent IGBTs with FWD Built-in device circuit (optically couple built-in thermistor) |
COMMON SPECIFICATIONS
| Die Attach Medium (soft solder) | Leaded (Pb/Sn/Ag) or Lead Free (Sn/Ag) |
| Substrate | Metallized Aluminum Nitride (AlN) Metallized Aluminum Oxide (Al203) |
| Wire Size | 5, 8, 10, 12,15 and 20 mils Al |
| Mold Type | Epoxy Mold Compound |
| Isolation | 3KV minimum |
| Rating | 1700V / 200A |
| Applications | Industrial, Medical, Automotive, Aviation, Renewable Energy |
