TPC @ 31! Commemorating 31 years of doing business. Since its foundation, Team Pacific Corporation’s commitment to build a lasting partnership has been its paramount goal. The company believes that going the extra mile to serve its business partners i... Sep 14, 2018
Silicon Carbide and Gallium Nitride Package Assembly at Team Pacific Corporation Silicon Carbide (SiC) & Gallium Nitride (GaN) are new chip technologies that are currently gaining attraction in the industry. These technologies are significantly better than Silicon when it comes to... Jul 5, 2018
Team Pacific Corporation is now capable of Mesa Wafer Sawing TPC commonly processes planar-type of dice (see Figure 1). Mesa-type of dice shown in Figure 2 have a different structure (mesa or table-top appearance) compared to planar-type. This ‘mesa-groove’ is... Jun 29, 2018
Flatness and the Transfer of Heat One of the biggest factors that is always considered in the semiconductor industry is heat and its movement. As we all know, semiconductor chips (or dice) produce heat during operation and when the h... Aug 14, 2017
TPC Upgrades to ISO9001:2015 TEAM PACIFIC CORPORATION is committed to provide the utmost quality in all the products and services that we offer. In this light, TEAM is now working towards upgrading to ISO9001:2015. The upgrade t... Jul 12, 2016
TEAM PACIFIC CORPORATION Joins PCIM Europe 2015 Manila, PH - TEAM PACIFIC CORPORATION , a semiconductor assembly and test services company running for almost 3 decades already, will be joing PCIM Europe 2015 this coming May 19-21 at the NCC Mite a... Apr 28, 2015
TEAM PACIFIC CORPORATION Participates in SEMICON Japan 2014 Tokyo, Japan - Team Pacific Corporation (TPC) showcased their True Two Leads TO-247, VPMP product line and other assembly capabilities at the SEMICON Japan 2014 last December 3 – 5, at the Tokyo Big ... Dec 22, 2014
TEAM PACIFIC CORPORATION Joins SEMICON Japan 2014 This coming December 3 to 5 2014, Tokyo Big Sight is hosting the “ SEMICON Japan 2014 ”; an exhibit which now covers beyond semiconductor manufacturing supply chain to the end products that will lead... Oct 9, 2014
TEAM PACIFIC CORPORATION LAUNCHES NEW POWER MODULE PACKAGES TEAM PACIFIC CORPORATION LAUNCHES NEW POWER MODULE PACKAGES , Open tool and ready for Mass Production , 10-JUN-2013 TAGUIG CITY, PHILIPPINES. Team Pacific Corporation has announced in the recently c... Jun 19, 2013
Versatile Power Module Package A carefully designed module package is essential to achieve the required reliability level of a device. Team Pacific is continously doing co-development with our customers to achieve a greater height... Jan 2, 2013