Powering the Future of EVs: High-Voltage Isolation Made Simple
In modern power semiconductor packaging design, increasing efficiency often equates to constraints on mounting space. For applications such as power suppliers, converters/inverters, and EV charging stations, safety standards have specific requirements for creepage distances. However, traditional semiconductor packages are likely to force a compromise between footprint and isolation.
Team Pacific Corporation's High Creepage TO268 2L package boasts a pin-to-pin creepage distance of 9.7 mm that easily meets pollution degree 2/3 requirements at higher operating voltages (>1000V). This improved package can accommodate fast switching semiconductors like diodes, MOSFETs, IGBTs and even resistors. It can operate as high as 3,300V under the cleanest, most-controlled micro-environments where there is no occurrence of conductive pollution, provided that the encapsulation material used has CTI > 600V. This package eliminates the need for additional potting or insulation, thus saving time, cost and board space.
This latest version of TO268 2L from Team Pacific offers an edge in superior isolation, high power density, robust reliability and direct retrofit (i.e. maintaining the standard TO268 footprint while expanding its benefits). It is ideal for fast charging EVs, industrial motor drives, HVDC power supplies and renewable energy inverters.
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