- JEDEC standard package.
- Solder plated or Tin plated finish.
- Isolated and non-isolated versions.
- Single and multi-chips versions.
- Matured product.
|
|
| Package Type and Lead Count |
: |
TO-268 |
| Package Dimension (LxWxT ) |
: |
0.745 x 0.630
x 0.198 in |
| Pad Size (Inch) |
: |
0.328 x 0.457 |
| Maximum Die Size (Inch) |
: |
0.288 x 0.417 |
| Number of Die Capable |
: |
Single / Dual |
|
|
