- A JEDEC standard package.
- Mature product.
- Available in 3lds and 5lds option.
- Solder dipped or Solder plated lead finish
- Pb free option available.
- Can be isolated or non isolated.
|
|
| Package Type and Lead Count |
: |
TO-264
3LDS |
| Package Dimension (LxWxT ) |
: |
1.832 x 0.783
x 0.196 |
| Pad Size (Inch) |
: |
0.436 x 0.586 |
| Maximum Die Size (Inch) |
: |
0.396 x 0.545 |
| Number of Die Capable |
: |
Single / Dual / Multichip |
|
|
