- Also known as the ISOTOP package, JEDEC standard.
- Isolated or non-isolated base plate options.
- Matured product.
- Guaranteed isolation at 3KV minimum.
- Available in 4 leads with 4 major leadframe design options.
- Buck and Boost configuration also available.
|
- Pad Size (inch)
- Pad B 0.500 x 0.700
- Pad C 0.600 x 0.730
- Parallel 0.332 x 0.500
- Anti-Parallel 0.332 x 0.500
|
|
| Package Type and Lead Count |
: |
SOT-227
4LDS |
| Package Dimension (LxWxT ) |
: |
1.50 x 0.980
x 0.476 |
| Pad Size (Inch) |
: |
0.600 x 0.730
(Pad C) |
| Maximum Die Size (Inch) |
: |
0.560 x 0.690 |
| Number of Die Capable |
: |
Single / Dual / Multichip |
|
|
