Team Pacific Corporation : Products

TO-268

Specifications

JEDEC standard package.
Solder plated or Tin plated finish.
Isolated and non-isolated versions.
Single and multi-chips versions.
Matured product.

TO-247

Specifications

JEDEC Standard package.
Mature product.
Available in 3lds and 5lds option.
Solder dipped or Solder plated lead finish.
Pb free option available.
Can be isolated or non isolated.

Extended TO-247

Specifications

Extended version (no hole) of TO247.
Can accommodate more chips or bigger chip sizes.
Available in 3lds and 5lds option.
Same lead finish options available.
Can be isolated or non isolated.

TO-264

Specifications

A JEDEC standard package.
Mature product.
Available in 3lds and 5lds option.
Solder dipped or Solder plated lead finish
Pb free option available.
Can be isolated or non isolated.

Extended TO-264

Specifications

A JEDEC standard package.
Mature product.
Available in 3lds and 5lds option.
Solder dipped or Solder plated lead finish
Pb free option available.
Can be isolated or non isolated.

SOT-227

Specifications

Also known as the ISOTOP package, JEDEC standard.
Isolated or non-isolated base plate options.
Matured product.
Guaranteed isolation at 3KV minimum.
Available in 4 leads with 4 major leadframe design options.
Buck and Boost configuration also available.

Extended SOT-227

Specifications

An extended version of the standard SOT-227
More flexible than the standard SOT-227
Under package development, already started building prototypes.
Much improved space for a more hybrid and integrated function.
Available in 4L and 6L versions (power terminals).
Isolated and non-isolated versions.
Optional signal (7 max each side) leads for circuit interface.

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