- TO-247 and Extended TO-247
- TO-264 and Extended TO-264
- TO-268
- SOT-227 and Extended SOT-227
- Power Modules
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| Includes power lead frame for a wide array of power applications and hybrid internal circuitry design. Features excellent thermal capability and performance, as well as a bigge die pad area configured either in parallel or in series. |
ISOPLUS™ Power Packe is a new package design exclusive to IXYS Corp. The normal copper leadframe is replaced with a Direct Copper Bond (DCB) substrate. The use of the ISOPLUS Family of internally isolated power devices enables high isolation capability, lower thermal resistance and increased power and temparature cycling capability than conventionally isolated devices. |
- ISOPLUS™ Family
- ISOPLUS TO-220™
- ISOPLUS TO-247™
- ISOPLUS TO-264™
- ISOPLUS TO-227™
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| HERMETIC METAL CAN ASSEBLY |
