- JEDEC standard package.
- Solder plated or Tin plated finish.
- Isolated and non-isolated versions.
- Single and multi-chips versions.
- Matured product.
Package Type and Lead Count
TO-268
Package Dimension (LxWxT )
0.745 x 0.630
x 0.198 in
Pad Size (Inch)
0.328 x 0.457
Maximum Die Size (Inch)
0.288 x 0.417
Number of Die Capable
Single / Dual
5s -- The Practice of Good Housekeeping was re-launched by TCIP Committee sometime march 2005
with the objective of making the company a clutter-free environment and to build the basic foundation for a kaizen oriented employees. | Click here.
Employee Suggestion System or ESS was the 2nd program re-launched by the TCIP Committee to be used as a vehicle in implementing the Elimination of Waste. | Click here.
