- A JEDEC standard package.
- Mature product.
- Available in 3lds and 5lds option.
- Solder dipped or Solder plated lead finish
- Pb free option available.
Package Type and Lead Count
TO-264
3LDS
Package Dimension (LxWxT )
1.832 x 0.783
x 0.196
Pad Size (Inch)
0.436 x 0.586
Maximum Die Size (Inch)
0.396 x 0.545
Number of Die Capable
Single / Dual / Multichip
EXT TO-264
- Extended version (no hole) of TO264.
- Can accommodate more chips or bigger chip sizes.
- Available in 3lds and 5lds option.
- Same lead finish options available.
Package Type and Lead Count
EXT TO-264
3LDS
Package Dimension (LxWxT )
1.832 x 0.783
x 0.196
Pad Size (Inch)
0.668 x 0.500
Maximum Die Size (Inch)
0.628 x 0.460
Number of Die Capable
Single / Dual / Multichip
* both can be isolated or non-isolated.
5s -- The Practice of Good Housekeeping was re-launched by TCIP Committee sometime march 2005
with the objective of making the company a clutter-free environment and to build the basic foundation for a kaizen oriented employees. | Click here.
Employee Suggestion System or ESS was the 2nd program re-launched by the TCIP Committee to be used as a vehicle in implementing the Elimination of Waste. | Click here.
