- JEDEC Standard package.
- Mature product.
- Available in 3lds and 5lds option.
- Solder dipped or Solder plated lead finish
- Pb free option available.
Package Type and Lead Count
TO-247
3LDS/ 5LDS
Package Dimension (LxWxT )
1.619 x 0.626
x 0.198 in
Pad Size (Inch)
0.289 x 0.441
Maximum Die Size (Inch)
0.250 x 0.400
Number of Die Capable
Single / Dual
EXT TO - 247
- Extended version (no hole) of TO247.
- Can accommodate more chips or bigger chip sizes.
- Available in 3lds and 5lds option.
- Same lead finish options available.
Package Type and Lead Count
EXT TO-247
3LDS/ 5LDS
Package Dimension (LxWxT )
1.619 x 0.626
x 0.198 in
Pad Size (Inch)
0.577 x 0.441
Maximum Die Size (Inch)
0.540 x 0.400
Number of Die Capable
Single / Dual / Multichip
* both can be isolated or non isolated
5s -- The Practice of Good Housekeeping was re-launched by TCIP Committee sometime march 2005
with the objective of making the company a clutter-free environment and to build the basic foundation for a kaizen oriented employees. | Click here.
Employee Suggestion System or ESS was the 2nd program re-launched by the TCIP Committee to be used as a vehicle in implementing the Elimination of Waste. | Click here.
