- also known as the ISOTOP package, JEDEC standard.
- Isolated or non-isolated base plate options.
- Matured product.
- Guaranteed isolation at 3KV minimum.
- Available in 4 leads with 4 major leadframe design options.
- Buck and Boost configuration also available.
Leadframe configurations:
Pad Size (inch)
Pad B 0.500 x 0.700
Pad C 0.600 x 0.730
Parallel 0.332 x 0.500
Anti-Parallel 0.332 x 0.500
Package Type and Lead Count
SOT-227
4LDS
Package Dimension (LxWxT )
1.50 x 0.980
x 0.476
Pad Size (Inch)
0.600 x 0.730
(Pad C)
Maximum Die Size (Inch)
0.560 x 0.690
Number of Die Capable
Single / Dual / Multichip
5s -- The Practice of Good Housekeeping was re-launched by TCIP Committee sometime march 2005
with the objective of making the company a clutter-free environment and to build the basic foundation for a kaizen oriented employees. | Click here.
Employee Suggestion System or ESS was the 2nd program re-launched by the TCIP Committee to be used as a vehicle in implementing the Elimination of Waste. | Click here.
