- Capable up to 8 inch wafer with CO2 Re-ionizer to maintain water resistivity of 0.1 to 1 mega ohm
- Can do 100% saw thru and partial cut.
DIE Attach
- Soft solder, Eutectic and Epoxy Die Attach process
- Furnace, tunnel, and fully automatic equipment
- Can do multi-layer die attach, hybrid or multi-chips.
5s -- The Practice of Good Housekeeping was re-launched by TCIP Committee sometime march 2005
with the objective of making the company a clutter-free environment and to build the basic foundation for a kaizen oriented employees. | Click here.
Employee Suggestion System or ESS was the 2nd program re-launched by the TCIP Committee to be used as a vehicle in implementing the Elimination of Waste. | Click here.
