Internally isolated power devices in TO247, TO220, and TO264 package outline.
· ISOPLUS220TM
· ISOPLUS247TM
· ISOPLUS264TM
A co-development effort with one of our major customer.
silicon chip and leadframe are soft soldered onto a Direct Copper Bonded substrate (DCB).
ISOPLUS220
and ISOPLUS247
ISOPLUS264
Package Descriptions:
- Isolation capability up to 2500V
- Circuit layout/ design flexibility, DCB (Direct Copper Bonded) ceramic technology.
- Same package outline as standard TO220, TO247, and TO264
- Solder dipped or plated lead finish
- Pb-free options available
* ISOPLUS is a registered trademark of IXYS DCB Isolated Packages. To visit the IXYS website, click here.
5s -- The Practice of Good Housekeeping was re-launched by TCIP Committee sometime march 2005
with the objective of making the company a clutter-free environment and to build the basic foundation for a kaizen oriented employees. | Click here.
Employee Suggestion System or ESS was the 2nd program re-launched by the TCIP Committee to be used as a vehicle in implementing the Elimination of Waste. | Click here.
