A 100% Filipino company, Team Pacific Corporation is a recognized leader in offshore product development and manufacturing for high-performance power devices. The company started auspiciously in 1987 as a subcontract assembler of semiconductor devices. it has since expanded its operations to become a top resource for assembly and test of Power and Hermetic Packages.
Located in an expansive industrial complex just 8 kilometers away from Manila's International Airport, TEAM co-develops new packages and leadframe designs for several partner manufacturers of electronics and semiconductor devices worldwide. Equipped with over 25 years of engineering experience, TEAM is able customize innovative packaging solutions for both standard and complex devices, particularly for large power packaging requirements of commercial and military applications.
Committed to product and service excellence, Team guarantees its customers, total value for money in terms of expertise on-time delivery, high yield and high Quality.