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PRODUCT SPECIFICATIONS

PACKAGE TYPE SOT 227 Pad B SOT 227 Pad C
Frame Type Pad B Pad C
Lead Type 4L 4L
Frame Material C110 / C102 / C122
Semi-Bright Finish / Matte Finish
C110 / C102 / C122
Semi-Bright Finish / Matte Finish
Package Dimension (LxWxH) inches : 1.50 x 0.980 x 0.476
mm      : 38.10 x 24.89 x 12.09
inches : 1.50 x 0.980 x 0.476
mm      : 38.10 x 24.89 x 12.09 
Pad Size inches : 0.500 x 0.700
mm      : 12.70 x 17.78
inches : 0.600 x 0.730
mm      : 15.24 x 18.54
Maximum Die Size inches : 0.460 x 0.660
mm      : 11.68 x 16.76
inches : 0.560 x 0.690
mm      : 14.22 x 17.52
Number of Die Capable Multi-chip:
Diode/IGBT/MOSFET/Thyristor die combination
Multi-chip:
Diode/IGBT/MOSFET/Thyristor die combination



COMMON SPECIFICATIONS

Die Attach Medium (soft solder) Leaded (Pb/Sn/Ag) or
Lead Free (Sn/Ag)
Substrate Metallized Aluminum Nitride (ALN)
Metallized Aluminum Oxide (AL203)
Wire Size 5, 8, 10, 12,15 and 20 mils Al
Mold Material KTMC 5100 or
HYSOL MG15F-0140A
Isolation 3KV minimum
Rating 1200V / 100A
Applications Industrial, Medical, Automotive, Aviation, Renewable Energy