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PRODUCT SPECIFICATIONS

PACKAGE TYPE SOT 227 P SOT 227 AP
Frame Type Parallel Anti-Parallel
Lead Type 4L 4L
Frame Material C110 / C102 / C122
Semi-bright Finish / Matte Finish
C110 / C102 / C122
Semi-bright Finish / Matte Finish
Package Dimension
(L x W x H)
inches : 1.50 x 0.980 x 0.476
mm      : 38.10 x 24.89 x 12.09
inches : 1.50 x 0.980 x 0.476
mm      : 38.10 x 24.89 x 12.09
Pad Size inches : 0.500 x 0.350 / pad
mm      : 12.70 x 8.89 / pad
inches : 0.500 x 0.350 / pad
mm      : 12.70 x 8.89 / pad
Maximum Die Size inches : 0.460 x 0.310 / pad
mm      : 11.68 x 7.87 / pad
inches : 0.460 x 0.310 / pad
mm      : 11.68 x 7.87 / pad
Number of Die Capable Dual / Multi-chip: Diode Dual / Multi-chip: Diode



COMMON SPECIFICATIONS

Die Attach Medium (soft solder) Leaded (Pb/Sn /Ag) or
Lead Free (Sn/Ag)
Substrate Metallized Aluminum Nitride (ALN)
Metallized Aluminum Oxide (AL203)
Wire Size 5, 8, 10, 12, 15 and 20 mil Al
Mold Material KTMC 5100 or
HYSOL MG15F-0140A
Isolation 3KV minimum
Rating 1200V / 100A
Applications Industrial, Medical, Automotive, Aviation, Renewable Energy