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PRODUCT SPECIFICATIONS

PACKAGE TYPE SOT 227 Non-Iso Pad B SOT 227 Non-Iso Pad C
Frame Type Paddleless (Pad B Frame) Paddleless (Pad C Frame)
Lead Type 4L 4L
Frame Material C110 / C102 / C122
Semi-Bright Finish / Matte Finish
C110 / C102 / C122
Semi-Bright Finish / Matte Finish
Package Dimension (LxWxH) inches : 1.50 x 0.980 x 0.476
mm      : 38.10 x 24.89 x 12.09
inches : 1.50 x 0.980 x 0.476
mm      : 38.10 x 24.89 x 12.09
Pad Size inches : 0.490 x  0.670
mm      : 12.45 x 17.02
inches : 0.560 x  0.670
mm      : 14.22 x 17.02
Maximum Die Size inches : 0.450 x 0.630
mm      : 11.43 x 16.00
inches : 0.520 x 0.630
mm      : 13.21 x 16.00
Number of Die Capable Multi-chip:
Diode/IGBT/MOSFET/Thyristor die combination
Multi-chip:
Diode/IGBT/MOSFET/Thyristor die combination



COMMON SPECIFICATIONS

Die Attach Medium (soft solder) Leaded (Pb/Sn/Ag) or
Lead Free (Sn/Ag)
Substrate DBC AL2O3 Bare Copper (for terminal connection only)
Wire Size 5, 8, 10, 12,15 and 20 mils Al
Mold Material KTMC 5100 or
HYSOL MG15F-0140A
Rating 1200V / 100A
Applications Industrial, Medical, Automotive, Aviation, Renewable Energy