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PRODUCT SPECIFICATIONS

PACKAGE TYPE EXT SOT 227 SMART SOT 227
Frame Type Parallel / Anti-Parallel SMART SOT-227
Lead Type 4L / 6L 4 Power Leads and 14 Signal leads
Frame Material C110 / C102 / C122
Semi-Bright Finish
C110 / C102 / C122
Semi-Bright Finish
Package Dimension (LxWxH)                                                    inches : 2.08 x 1.10 x 0.550
mm      : 52.83 x 27.94 x 13.97
inches : 2.08 x 1.10 x 0.550
mm      : 52.83 x 27.94 x 13.97 
Pad Size

inches : 0.580 x 0.820 (Pad A)
inches : 0.470 x 0.580 (Pad B)
inches : 0.430 x 0.580 (Pad C)
mm      : 14.73 x 20.83 (Pad A)
mm      : 11.94 x 14.73 (Pad B)
mm      : 10.92 x 14.73 (Pad C)

inches : 0.425 x 0.680 / pad
mm      : 10.79 x 17.27 / pad
Maximum Die Size

inches : 0.540 x 0.780 (Pad A)
inches : 0.430 x 0.540 (Pad B)
inches : 0.390 x 0.540 (Pad C)
mm      : 13.72 x 19.81 (Pad A)
mm      : 10.92 x 13.72 (Pad B)
mm      : 9.91 x 13.72 (Pad C)

inches : 0.385 x 0.640 / pad
mm      : 9.78 x 16.26 / pad
Number of Die Capable

Dual Driver, 2 Independent IGBTs with FWD Built-in device circuit (optically couple built-in thermistor)

IGBT and MOSFET Modules Built-in IC (gate driver protection); Built-in thermistor (optional)



COMMON SPECIFICATIONS

Die Attach Medium (soft solder) Leaded (Pb/Sn/Ag) or
Lead Free (Sn/Ag)
Substrate Metallized Aluminum Nitride (AIN)
DBC AL2O3 Bare Copper (patterned substrate)
Wire Size 5, 8, 10, 12,15 and 20 mils Al
Mold Material KTMC 5100 or
HYSOL MG15F-0140A
Isolation 3KV minimum
Rating 1700V / 200A
Applications Industrial, Medical, Automotive, Aviation, Renewable Energy