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PRODUCT SPECIFICATIONS

Package Type SOT 227 DBC SOT 227 DBC
Frame Type Paddleless (Pad B Frame) Paddleless (Pad C Frame)
Lead Type 4L 4L
Frame Material C110 / C102 / C122
Semi-Bright Finish / Matte Finish
C110 / C102 / C122
Semi-Bright Finish / Matte Finish
Package Dimension (LxWxH) inches : 1.50 x 0.980 x 0.476
mm      : 38.10 x 24.89 x 12.09
inches : 1.50 x 0.980 x 0.476
mm      : 38.10 x 24.89 x 12.09 
Pad Size Per required DBC substrate Per required DBC substrate
Maximum Die Size Per required DBC substrate Per required DBC substrate
Number of Die Capable Multi-chip:
Diode/IGBT/MOSFET/Thyristor die combination
Multi-chip:
Diode/IGBT/MOSFET/Thyristor die combination



COMMON SPECIFICATIONS

Die Attach Medium (soft solder) Leaded (Pb/Sn/Ag) or
Lead Free (Sn/Ag)
Substrate DBC AL2O3 Bare Copper (patterned substrate)
DBC AL2O3 Nickel Plated (patterned substrate)
Wire Size 5, 8, 10, 12, 15 and 20 mils Al
Mold Material KTMC 5100 or
HYSOL MG15F-0140A
Isolation 3KV minimum
Rating 1200V / 100A
Applications Industrial, Medical, Automotive, Aviation, Renewable Energy