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Products
PRODUCT SPECIFICATIONS
| Package Type | SOT 227 DBC | SOT 227 DBC |
|---|---|---|
| Frame Type | Paddleless (Pad B Frame) | Paddleless (Pad C Frame) |
| Lead Type | 4L | 4L |
| Frame Material | C110 / C102 / C122 Semi-Bright Finish / Matte Finish |
C110 / C102 / C122 Semi-Bright Finish / Matte Finish |
| Package Dimension (LxWxH) | inches : 1.50 x 0.980 x 0.476 mm : 38.10 x 24.89 x 12.09 |
inches : 1.50 x 0.980 x 0.476 mm : 38.10 x 24.89 x 12.09 |
| Pad Size | Per required DBC substrate | Per required DBC substrate |
| Maximum Die Size | Per required DBC substrate | Per required DBC substrate |
| Number of Die Capable | Multi-chip: Diode/IGBT/MOSFET/Thyristor die combination |
Multi-chip: Diode/IGBT/MOSFET/Thyristor die combination |
COMMON SPECIFICATIONS
| Die Attach Medium (soft solder) | Leaded (Pb/Sn/Ag) or Lead Free (Sn/Ag) |
| Substrate | DBC AL2O3 Bare Copper (patterned substrate) DBC AL2O3 Nickel Plated (patterned substrate) |
| Wire Size | 5, 8, 10, 12, 15 and 20 mils Al |
| Mold Material | KTMC 5100 or HYSOL MG15F-0140A |
| Isolation | 3KV minimum |
| Rating | 1200V / 100A |
| Applications | Industrial, Medical, Automotive, Aviation, Renewable Energy |