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Products
PRODUCT SPECIFICATIONS
| PACKAGE TYPE | eXp TO 247 |
|---|---|
| Frame Type | Extended (clip mount) |
| Lead Type | 3L |
| Frame Material | Full Nickel and Selective Nickel Plated |
| Package Dimension (LxWxH) |
inches : 1.662 x 0.626 x 0.198 |
| Pad Size | inches : 0.500 x 0.575 mm : 12.70 x 14.61 |
| Maximum Die Size | inches : 0.402 x 0.556 mm : 10.21 x 14.12 |
| Number of Die Capable | Single / Dual |
COMMON SPECIFICATIONS
| Die Attach Medium (softsolder) | Leaded (Pb/Sn/Ag) or Lead Free (Sn/Ag) |
| Wire Size |
5, 8, 10, 12,15 and 20 mils Al |
| Mold Material | Kyocera 300TS-1 |
| Isolation | Up to 3.5KV (with DBC application) |
| Lead Finish | Solder Dip: (Sn/Pb) or Pb Free (Sn/Ag/Cu) Tin Plate: (Pb/Sn) or Pb Free (Sn) |
| Rating | 1200V / 75A |
| Applications | Industrial, Medical, Automotive, Aviation, Renewable Energy |
| Features |
Isolated Diode Rectifiers and other 3-Lead Discrete Devices |