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PRODUCT SPECIFICATIONS

PACKAGE TYPE eXp TO-247 Twin
Frame Type Extended (clip mount)
Lead Type 5L / 6L
Frame Material Full Nickel and Selective Nickel plated
Package Dimension (LxWxH) inches : 1.662 x 0.626 x 0.198  
mm : 42.21 x 15.90 x 5.03
Pad Size (individual pad) inches : 0.500 x 0.575
mm : 12.70 x 14.61
Maximum Die Size (individual pad) inches : 0.402 x 0.556
mm : 10.21 x 14.12
Number of Die Capable Dual / Multiple

 


COMMON SPECIFICATIONS

Die Attach Medium (softsolder) Leaded (Pb/Sn/Ag) or
Lead Free (Sn/Ag)
Wire Size 5, 8, 10, 12,15 and 20 mils Al
Mold Material Kyocera 300TS-1
Isolation Up to 3.5KV (with DBC application)
Lead Finish Solder Dip: (Sn/Pb) or Pb Free (Sn/Ag/Cu)
Tin Plate: (Pb/Sn) or Pb Free (Sn)
Rating 1200V / 75A
Applications Industrial, Medical, Automotive, Aviation, Renewable Energy
Features Isolated Diode Rectifiers and other 3-Lead Discrete Devices
Flexible Terminal lead Assignment ( Gate / Emitter / Collector)