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Team Pacific Corporation is now ready for the Silver Sintering Technology
Sintering is one of the emerging technologies in power devices because of its compatibility to high operating temperature packages that the Silicon Carbide (SiC) and Gallium Nitride (GaN) packages normally require. Moreo... ....Read More
Flatness and the Transfer of Heat
One of the biggest factors that is always considered in the semiconductor industry is heat and its movement. As we all know, semiconductor chips (or dice) produce heat during operation and when the heat stays on the chip... ....Read More
TPC Upgrades to ISO9001:2015
 TEAM PACIFIC CORPORATION is committed to provide the utmost quality in all the products and services that we offer. In this light, TEAM is now working towards upgrading to ISO9001:2015. The upgrade timeli... ....Read More
TEAM PACIFIC CORPORATION Joins PCIM Europe 2015
 Manila, PH - TEAM PACIFIC CORPORATION, a semiconductor assembly and test services company running for almost 3 decades already, will be joing PCIM Europe 2015 this coming May 19-21 at the NCC Mite at Nuremberg Mess... ....Read More