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Silicon Carbide and Gallium Nitride Package Assembly at Team Pacific Corporation
  Silicon Carbide (SiC) & Gallium Nitride (GaN) are new chip technologies that are currently gaining attraction in the industry. These technologies are significantly better than Silicon when it comes to perform... ....Read More
Team Pacific Corporation is now capable of Mesa Wafer Sawing
   TPC commonly processes planar-type of dice (see Figure 1). Mesa-type of dice shown in Figure 2 have a different structure (mesa or table-top appearance) compared to planar-type. This ‘mesa-groove&rs... ....Read More
Team Pacific Corporation is now ready for the Silver Sintering Technology
Sintering is one of the emerging technologies in power devices because of its compatibility to high operating temperature packages that the Silicon Carbide (SiC) and Gallium Nitride (GaN) packages normally require. Moreo... ....Read More
Flatness and the Transfer of Heat
One of the biggest factors that is always considered in the semiconductor industry is heat and its movement. As we all know, semiconductor chips (or dice) produce heat during operation and when the heat stays on the chip... ....Read More