A carefully designed module package is essential to achieve the required reliability level of a device. Team Pacific is continously doing co-development with our customers to achieve a greater heights for quality products and simplification of processess. This establishes our R&D group to design and develop a new versatile module package that is flexible and easy integration with components using solderless connections. The package is ideal for high power applications and fits to a variety of circuit configurations.

Main Features:

*Compact module design

*PressFit technology signal terminal and screw type power terminals for completely solderless connections

*High power density that can  handle up to 300A and 1700V

*Elevated signal terminals for better creepage distance

*Configuration flexibility: Diode, Thyristor, IGBT, Mosfet and intelligent circuit configuration