A carefully designed module package is essential to achieve the required reliability level of a device. Team Pacific is continously doing co-development with our customers to achieve a greater heights for quality products and simplification of processess. This establishes our R&D group to design and develop a new versatile module package that is flexible and easy integration with components using solderless connections. The package is ideal for high power applications and fits to a variety of circuit configurations.
- Compact module design
- Solderless connections
- High power density that can handle up to 300A and 1700V
- Elevated signal terminals for better creepage distance
- Configuration flexibility: Diode, Thyristor, IGBT, Mosfet and intelligent circuit configuration