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About Us
History Growth Drivers
| 1987 | Started Hermetics Metal Can and CDIPs; Optoelectronics |
| 1989 | Introduction of Power Devices and Standard PDIPs |
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1991 |
Power Devices: SOT 227 and TO 247 |
| 1993 |
Power Devices: TO 264 and IcePAK |
| 1994 |
Power Devices: TO 268 and Hybrid Metal Cans |
| 1998 | Application Specific Power Module (ASPM) |
| 1999 | Assembly and Test: Hermetic Packages |
| 2000 | Test Power Devices |
| 2001 | Power Devices: Co-development for ISOPLUS Packages |
| 2003 | Power Modules: SMART SOT-227 |
| 2005 | MSC Outsourcing Power Modules and DO's Packages |
| 2008 | Onwards - Continuous Co-development for Packaging Solutions with Customers |
| 2011 | Launched new package capabilities eXp TO247 (Patented) |
| 2012 | Launched new packages Power Modules (VPMP1, VPMP2, VPMP3, VPMP4, VPMP4i,) Team owned Packages
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| 2013 | Launched New Power Module packages (VPMP5 and VPMP6) Team Owned Packages |
| 2013 | Launched TO-247 True 2L |
| 2018 | Qualified New Processes under R&D Group (Ag Sintering, Mesa Wafer Sawing, SiC Wafer Sawing) |